Due to the electrical characteristics teflon circuits are used in the high frequency technology. Furhtermore Teflon PCB´s show a very good chemical stability, too.

 

 

 

 

 

 

 

 

Product information:
Material customer request
Cu thicknesses 6 µm, 9 µm, 12 µm, 17 µm, 35 µm, 70 µm,
 or customer request
Multilayer production lamination with conventional prepreg
 (hybrid ML) or bonding film
Surfaces
     
  • solder resist possible
  • HASL, leaded or lead-free
  • Imersion or galvanic Ni/Au
  • Pb/Sn refused
  • Imersion or galvanic Sn
  • other organic surfaces customer request
Width / gap + 10 µm accuracy
Outline cutting, routing, punching, scoring (V-pad)
Slit width  Routing, slot drilling  > 0.4 mm: + 0.1 mm
Slit tolerance pth +/- 0.15 mm
Low milling/Countersinks On both sides, accuracy + 0.1 mm of depth tolerance, 60° / 90° / 120°
Smallest hole diameter 0,1 mm finished hole
Aspect ratio Standard 1:4, special relationship 1:10
Diameter accuracy not plated 0.4 - 5.0 mm:          +/- 0.05 mm
 > 5.0 mm:               +/- 0.15 mm
Drill position accuracy < 300 mm:   +/- 0.05 mm
 > 300 mm:   +/- 0.1 mm
Bow & Twist 1%
Further options - Press fit technology
- Burried- & Blind Vias
- Lamination on metal core
   

HF-Multilayer / Hybrid-Multilayer
4 ML Teflon
 thickness 3,2 mm
 metallized borders
 

If you have any special requirements, please contact us.