Rigid-flexible Multilayer up to 24 layer, thicknesses 0.5 - 5 mm

19 layer rigid-flex board
In bookbinder-technology

 

Product information:
Material - Full Polyimide structure for high temperature application,
 - Thermount (Aramid)
 - Other special material: Customer request
Cu thicknesses  Flex 70 µm, rigid up to 600 µm
Max. size 600 mm x 420 mm
Heat-Sink From aluminum, copper, CIC, CMC or Heat sink paste
 Surfaces and thicknesses: Customer request
- Cold gluing
- Warm gluing with No flow Prepreg or acryl adhesive
- Heat sink paste in the silk-screen printing, thicknesses to 1 mm
- 2 metal cores with a thickness of up to 0.5 mm can be included
Surfaces - Cover foils for the increase of insulation resistance
- Soldering varnish
- Mixed surface finish
- Other organic Cu surfaces: Customer request
Reliability - Special built-up: 1000 cycles -65° C to + 150° C
- E-test: up to 500V
Low milling / Countersinks On both sides, accuracy + 0.1 mm of depth tolerance, 60° / 90° / 120°
Weitere Optionen Bookbinder technology - patented procedure:
 Adaption of the flexible part according to the situation after installation: Target is to get an flexible part without any tensile impact to the flex part.
Advantage: increased durability, easier installation
 Kevlar tearing protection
Constructions with up to 1 million bending cycles
Micro via technology

 
   

16 layer rigid-flex board
Mixed surface: HAL + immersion tin in soldering frame,
Mil tested, thickness 3.6 mm,
580 x 420 mm

 

10 layer rigid-flex board,
sequential built-up with burried vias & CMC cores for Cte - management
(cu-molybdenum-cu)

 
   

If you have any special requirements, please contact us.