This technology is for multiple use and applicable in all usual materials for flexible, rigid-flex and rigid Multilayer PCB´s.

Burried-vias are assuredly filled by our pressing process or with plugging paste.

The micro-via is being manufactured by a mechanical drilling down to 0,1 mm and / or laser drilling. Due to the horizontal pth process Vaas is able to metallize micro-vias very reliably.

 Micro- (blind-) via Multilayer with CIC for thermal management and for compensation of extension
 

Cross-section of a 10 layers Rigid-Flex PCB with micro-vias, filled buried-vias